Home Processes For Printed Circuit Board Fabrication Specific Recommendations for Pre-Cleaning Innerlayers
Specific Recommendations for Pre-Cleaning Innerlayers PDF Print E-mail
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The general recommendation is for a two-stage cleaning system, the first stage is a strong alkaline cleaner, MicroClean™ CuL (RD-19), used at 130O F (55O C) for one minute (this may be shortened to 30 seconds at 150O F (65O C). The second stage is an acid cleaner. The most common acid cleaner used in the US is MicroClean™ NE (RD-15), which is a mild acid cleaner based on Sulfuric Acid. It is used at 30-60 seconds at 120O-130O F (50O-55O C), and works well with Copper foils typical in the US, which do not have much staining/tarnish. For foils that are heavily tarnished, a stronger acid cleaner based on Hydrochloric acid is required. This cleaner is called: MicroClean™ ZE (RD-10). It is important to note that MicroClean ZE cannot be used in spray equipment which has stainless steel components, as it attacks stainless steel.

If the panels being cleaned are completely covered with foil, the laminate type does not have go be considered, but if laminate is exposed to the cleaner, MicroClean™ CuL (RD-19) may be too alkaline for polyimide, and a less alkaline cleaner, FlexClean™ (RD-11) must be substituted.