The Innerlayer Production Process

Printed Circuit Board Fabrication

The Innerlayer Production Process

The Innerlayer Production Process

PDF

Print

E-mail

The Innerlayer Production Process

Alkaline Cleaner

Microetch or Acid Clean

Resist Application & Image

Develop

MicroClean™ CuL (RD-19) Spray, Powerful, Non-Tarnishing

MicroClean™ S (RD-17) Spray or Immersion, Low Metal Pickup

Developer HC (RD-41)
Highly Concentrated

MicroClean™ CuLX (RD-68) Immersion, Powerful, Non-Tarnishing

MicroClean™ ZE (RD-10) Immersion

UltraDeveloper (RDX-1076) Developer & Cleaner

FLEXCLEAN DM (RD-11) Spray or Immersion for Polymide

UniEtch (RD-84)
Microetch

Sodium Carbonate Photoresist Developer (RD-39) Eco. Dry Form

Etch

Photoresist Stripping

Alkaline Cleaners

Oxide

RESISTRIP L (RD-56) Long Life
Non-Tarnishing

FLEXCLEAN DM (RD-11) For Flex Circuits

ChemBond™ EC (RDZ-1601/1602) Oxide Replacement
Alternate Oxide for Laminate Adhesion

RESISTRIP™ EC-1 (RDZ-1590) Ultra Low Cost No VOC, Innerlayer Photoresist Stripper

MicroClean™ EC-3 (RDZ-1605) An Alkaline Spray Cleaner for Cleaning Copper Foils